PRESS RELEASE
Global Communication Semiconductors, Inc. (GCS) Announces
Breakthrough in InP based PIN Detectors.
GCS,
meets performance requirements for 1310 and 1550 PIN detectors
utilized in 10G telecommunications applications.
December 3, 2001, TORRANCE, CALIF. - - - GCS,
Inc. (Global Communications Semiconductor, Inc.) a leading pure-play
III-V compound semiconductor foundry service provider, announced
that the company had reached a major milestone in the development of
its 4"-wafer InGaAs mesa PIN photodiode process for 1310 nm and
1550 nm high-speed optical fiber communication applications.
"Conventional planar InP-based photodiode
process with Zn-diffused p-contact typically deals with small size
wafers of 2-inches (50mm) in diameter, and is limited in speed
performance due to inherent parasitic capacitance." remarked
Dr. Samuel C. Wang, Vice President of Optoelectronics, "GCS'
mesa approach offers advantages of large wafer size (4-inches,
100mm) processing as well as higher speed performance. The
breakthrough came as successful passivation of the exposed small-bandgap
intrinsic layer in the device's mesa structure. The diode's
responsivity exceeds 0.9 A/W at 1310 nm, while the -3dB bandwidth
hits 19 and 23 GHz for 24- and 18-micron diameter diodes,
respectively, measured with a 50 ohm input impedance TIA. continued
Dr. Wang.
This new InGaAs PIN PD process represents an
important addition to GCS’ portfolio of Optoelectronics production
foundry services, such as GaAs PIN and MSM photodetectors, optical
modulators, optical ridge waveguides and QWIP.
"We have taken a major step forward to answer the need for
10Gb/sec requirements by the manufacturers of telecommunications
lasers. GCS’ InP based PIN diode foundry process yields dark
current figures suitable for 10Gb/sec applications and beyond."
commented Dr. Owen K. Wu, CEO and President of GCS. "This
process breakthrough in optoelectronics coupled with GCS’
state-of-the-art InGaP and InP HBT technologies brings OEIC closer
to reality." Continued Dr. Wu.
Global
Communication Semiconductors Inc., based in Torrance, California, an
ISO 9002 certified company, provides compound semiconductor foundry
services to the wireless telecommunication and high-speed networking
industries. GCS currently offers foundry service for both InGaP and
InP HBT processes and provides optoelectronic foundry services for
PIN diodes used in the fiber optic communication market.
For
more information on GCS contact:
Bill
Vitez
Director
of Marketing and Sales
Global
Communication Semiconductors, Inc.
23600
Telo Avenue, Suite 118
Torrance,
CA 90505
Tel:
310-530-7274 x 714
Fax:
310-517-8201
Email:
bvitez@gcsincorp.com
Web
site: http://www.gcsincorp.com
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