PRESS RELEASE
Global Communication
Semiconductors, Inc. (GCS) Announces
the release of Agilent Technologies’ ADS design kit for its InGaP
HBT process
June 2, 2003, TORRANCE, CALIF. - - -
GCS, Inc. (Global Communications Semiconductor, Inc.) a pure-play
III-V compound semiconductor wafer foundry announced today the
release of an InGaP HBT design kit to support Agilent
Technologies’ Advanced Design Systems (ADS) EDA software. The
design kit, developed for GCS’s InGaP HBT P2 process, is in
response to the strong demand for WLAN (802.11) PA applications.
The
InGaP HBT P2 design kit was developed in collaboration between GCS
and Agilent Technologies and it provides a complete set of
schematics, simulation models, and layout artwork for both active
and passive elements. The
active device models include both Gummel-Poon and VBIC formats,
which provide designers with greater flexibility in design.
Measured S-parameter files are also included as part of the
design kit. Designers can create layout using a series of fixed
artwork and Parameterized Artwork Macros (based on the use of
Agilent’s Graphical Cell Compiler and Application Extension
Language). The
implementation of the GCS design kit in the ADS environment allows
customers immediate access to the innovative P2 process.
“Our
P2 process was developed specifically for WLAN power amplifiers. A
foundry design kit is offered as an extension to our foundry
services,” commented Dr. Owen Wu, Founder & Chief Strategic
Officer of GCS. “In
the competitive WLAN landscape, time-to-market translates into
market share. The idea
here is to help our customers achieve first pass design success with
minimal design iteration for 802.11 a, b & g applications.
In addition to the P2 process, GCS also offers several other
qualified InGaP HBT processes (P1 for WCDMA PA, P5 for GSM PA, P6
for infrastructure gain blocks, and D1 for high-speed digital
circuits). GCS will
continue to roll out the design kits for these processes throughout
the remainder of 2003”, continued Dr. Wu.
“We
are extremely pleased with the results of our collaboration with
GCS,” said Charles Plott, Marketing Manager, Agilent EEsof EDA.
“WLAN is a really competitive market and many of our
customers are actively playing in that arena.
The availability of a GCS design kit for ADS will give them a
broader range of manufacturing options”
Agilent
Technologies’ Advanced Design System (ADS) offers simulation and
layout capabilities for complete front-to-back MMIC design in an
integrated design flow. Foundry
design kits allow MMIC designers worldwide to use ADS seamlessly
with processes used by custom IC manufacturers worldwide.
Global
Communication Semiconductors Inc., based in Torrance, California, an
ISO 9001-2000 certified company, provides
compound semiconductor foundry services to the wireless
telecommunication, high-speed networking, aerospace and defense
industries. GCS currently offers foundry services for InGaP HBT, InP
HBT and PHEMT processes and provides optoelectronic foundry services
for QWIP detectors, modulators & PIN diodes used in the
surveillance, security and fiber optic communication markets.
For
more information on GCS contact:
Wing
Yau
Director
of Marketing & Application Engineering
Global
Communication Semiconductors, Inc.
23155
Kashiwa Court,
Torrance,
CA 90505
Tel:
310-530-7274 x 107
Fax:
310-517-8200
Email:
wyau@gcsincorp.com
Web
site: http://www.gcsincorp.com
|
