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PRESS RELEASE

Global Communication Semiconductors, Inc. (GCS) Announces High Performance InGaP HBT Process for WLAN Applications

April 21, 2003, TORRANCE, CALIF. - - - GCS, Inc. (Global Communications Semiconductor, Inc.) a pure-play III-V compound semiconductor wafer foundry announced today that it’s proprietary High Performance InGaP HBT process, currently in high volume production, will now be offered to address the demanding requirements of 802.11a/b/g power amplifiers required in WLAN products.  

“GCS has a number of proprietary InGaP HBT processes.  Our P2 process was developed specifically for 802.11 power amplifiers.  This process provides a better breakdown voltage and has a self-limiting current feature that prevents total burnout,” commented Dr. Sam Lee, Chief Executive Officer of GCS.  “This process gives a competitive edge to our customers addressing the rapid growth WLAN market.  It has long been recognized that GaAs (Gallium Arsenide) based power amplifiers and particularly InGaP HBT designs are exceptionally suited for the more demanding linearity requirements of 802.11a and 802.11g WLAN standards.  GCS’ P2 process distinguishes itself a notch above the competition with better gain, linearity and lower dc power consumption as compared to SiGe and other GaAs based technologies.  The power consumption of Power Amplifier Modules utilizing the P2 process has been reduced by 30% allowing for significantly longer battery life that is crucial for laptop and other portable WLAN applications.  In addition, our cost structure allows us to compete successfully for the high volume markets, where we are currently shipping in a high volume WLAN product program,” continued Dr. Lee.

Global Communication Semiconductors Inc., based in Torrance, California, an ISO 9002 certified company, provides compound semiconductor foundry services to the wireless telecommunication and high-speed networking industries. GCS currently offers foundry service for both InGaP and InP HBT processes and provides optoelectronic foundry services for PIN diodes used in the fiber optic communication market. Additional information may be found at www.gcsincorp.com.

For more information on GCS contact:

Bill Vitez

Director of Sales

Global Communication Semiconductors, Inc.

23155 Kashiwa Court,

Torrance, CA 90505

Tel:  310-530-7274 x 138

Fax:  310-517-8200

Email:  bvitez@gcsincorp.com

Web site: http://www.gcsincorp.com