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PRESS RELEASE

 

Global Communication Semiconductors, Inc. (GCS) Announces High Performance InGaP HBT Process for GSM PA Applications

 

March 4, 2005, TORRANCE, CALIF. - - - GCS, Inc. (Global Communications Semiconductor, Inc.) a pure-play III-V compound semiconductor wafer foundry announced today that   its proprietary High Performance InGaP HBT process will now be offered to address the demanding ruggedness requirements of power amplifiers for GSM cell phone applications.

 

“GCS has a number of proprietary InGaP HBT processes.  Our P5 process was developed specifically for GSM power amplifiers.  This process provides a breakdown voltage of 18V and has a self-current-limiting feature that prevents amplifier burnout under high VSWR condition,” commented Dr. Sam Lee, Chief Executive Officer of GCS. “To the best of our knowledge, this process is by far the most rugged InGaP HBT process available today that provides an output power of 4 watts, while simultaneously achieving high PAE (>60%) and surviving high VSWR (25:1 at Vcc=5V). This HBT process gives a competitive edge to our customers in addressing the ruggedness requirement and compact chip size for GSM quad band PA. Besides its superior ruggedness performance at saturated output power, GCS’ P5 process also distinguishes itself a notch above the competition with excellent linearity and PAE at linear operation. This performance advantage makes the P5 process suitable and ideal for all modes of GSM applications, including the DCS/PCS and the GSM EDGE. In addition, our cost structure allows us to compete successfully for the high volume markets, where we are currently shipping wafers on multiple high volume product programs,” continued Dr. Lee.

Global Communication Semiconductors Inc., based in Torrance, California, an ISO 9002 certified company, provides compound semiconductor foundry services to the wireless telecommunication and high-speed networking industries. GCS currently offers foundry service for InGaP and InP HBT, Power and switch PHEMT processes and provides optoelectronic foundry services for PIN diodes and lasers used in the fiber optic communication market. Additional information may be found at www.gcsincorp.com.

For evaluation sample and more information on GCS contact:

Simon Yu

VP, Sales and Marketing

Global Communication Semiconductors, Inc.

23155 Kashiwa Court,

Torrance, CA 90505

Tel: 310-530-7274 x 138

Fax: 310-517-8200

Email: syu@gcsincorp.com

 

Or

 

Wing Yau

Director, Marketing and Applications Engineering

Global Communication Semiconductors, Inc.

23155 Kashiwa Court,

Torrance, CA 90505

Tel: 310-530-7274 x 107

Fax: 310-517-8200

Email: wyau@gcsincorp.com

Web site: http://www.gcsincorp.com