Global Communication Semiconductors, Inc.

RF Integrated Passive Devices


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Integrated Passive Devices

  • MMIC passives for compact size and low-cost manufacturing
  • Ideal for low pass filters and off-chip matching networks
  • Improve front-end module integration by reducing component count
  • Meets or exceeds most environmental test requirements
    • Applications:
  • Off-chip matching element for GSM PA module
  • LPF (low and high band) for cell phone PA module

    Features:
  • Thin film resistor
  • Thick metal for high Q compact spiral inductors
  • Multi layers nitride for MIM cap
    		• Typical Q-Factors:

    MIM Capacitance (pF)

    Q

    0.5

    240

    1.0

    370

    15

    410

     

     

    Spiral Inductor (nH)

    Q

    3

    35

    7

    25